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Major international manufacturers are competing for the next generation of high-bandwidth memory (HBM) required for AI chipsets. Samsung has a good cooperative relationship with Nvidia and is expected to become the only manufacturer supplying HBM3E modules.
Samsung has launched a 12-layer HBM3E module with better performance than its competitors and may win all orders from Nvidia. This helps boost profits at Samsung’s semiconductor unit. While other Korean companies also competed for these orders, Samsung stood out.
Samsung is expected to start supply in September 2024, but specific details have not yet been confirmed.
(Source: enanyang Image source: freepik)
