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Google will use Samsung’s latest Exynos 2400 blueprint to build its new Tensor G4 chipset for its upcoming Pixel 9 smartphone. The chip will utilize Samsung’s 4nm manufacturing process and is expected to use an eight-core CPU design, unlike Exynos’ ten-core design.
At the same time, Pixel 9 is expected to run at a lower temperature, thanks to Samsung’s fan-out water-level packaging technology. Samsung will also use the Exynos 2500 chipset in the Galaxy S25 series and plans to become the market leader by 2030.
Because demand for advanced chips from large technology companies is growing, and Samsung, as an integrated equipment manufacturer, has the facilities to manufacture, design and package chips, giving it a competitive advantage in the chip market.
(Source: ChannelNews Image source: Freepik)
