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Korean media reported that Samsung Electronics successfully secured orders from NVIDIA to provide 2.5D packaging services, including Interposer and I-Cube technology, but HBM and GPU production were handled by other companies. 2.5D packaging places the CPU, GPU, etc. on the interposer.
Nvidia’s A100 and H100 series of GPUs and Intel’s Gaudi series use this technology. Samsung provides Nvidia with services to integrate four HBM chips, but integrating eight HBM chips requires 16 interposers, reducing efficiency.
Therefore, Samsung is developing panel-level advanced packaging (PLP) technology. Perhaps due to insufficient production capacity of TSMC, Nvidia placed an order with Samsung, which indicates that Samsung may receive more orders in the future.
(Source: enanyang Image source: unsplash)
